The Workhorse of Industrial Copper
ETP Copper (C11000) plates provide the optimal balance of conductivity (100% IACS), formability, and cost-effectiveness. With a controlled oxygen content of 0.02-0.04%, ETP copper develops protective oxide layers that resist hydrogen embrittlement – critical for
Power substation grounding grids
Chemical processing vessels
Architectural cladding systems
Heat exchanger baffle plates
Fabrication Advantages
Weldability: Excellent results with TIG, MIG, and resistance welding
Formability: 45% elongation allows deep drawing/stamping
Corrosion Resistance: Patina formation protects against atmospheric corrosion
Thermal Conductivity: 391 W/m·K at 20°C
Available Dimensions
|
Thickness (mm) |
Width (mm) |
Length (mm) |
Surface Finish |
|---|---|---|---|
|
6 - 50 |
1000 - 2500 |
2000 - 6000 |
Mill, Polished, Brushed |
|
0.5 - 5 |
500 - 1500 |
1000 - 3000 |
Cold Rolled, Annealed |